Semtech’s Corporate Blog

利用线性可插拔光链路革新 AI 和 ML 互联技术

2024 年 4 月 24 日

Signal Integrity, AI, Optical

功耗、延迟和成本。人工智能 (AI) 和机器学习 (ML) 数据中心互连的三驾马车。每一代新的互连技术都推动了 mW/Gbps 和美元/Gbps 的降低。功耗不仅仅与数据中心的运营成本有关，它还与可持续发展有关。 

Enter Linear Pluggable Optics (LPO) links. Harnessing the power of an innovative Linear Drive architecture, LPO links are here to drive innovation across power, latency and cost like never before.  

LPO links can significantly reduce module power consumption when compared to traditional Digital Signal Processing (DSP) based solutions, without compromising performance. This also comes with the benefit of reduced cooling costs. 

By not retiming the data, latency is significantly reduced, enabling faster data transfer times during AI model training and inference – critical for accelerating AI performance. 

Swapping from DSP-based solutions to LPO translates into significant cost savings, driving down capital expenditure. Operational costs are also driven down by lower power and cooling costs. 

At this year’s OFC 2024 exhibition, Semtech showcased a plethora of technologies aimed at innovation and technological leadership. The highlight? The next-gen 400Gbps and 800Gbps LPO modules demonstrating remarkable compatibility and scalability. 

In conclusion, these LPO links are not just redefining the capabilities of AI and ML data center interconnects, but they are also paving the way for a more connected, sustainable, and tech-intelligent future.  

So, if you're into data center management or network engineering, keep an eye on this space. The future is intelligent, interconnected, and at Semtech, it's happening now! 

关于 Semtech 的信号完整性/光通信产品  

Semtech’s optical networking product platforms provide high-performance signal integrity for optical module solutions used by leading companies in the data center/enterprise networking, wireless infrastructure and passive optical network/FTTx markets. For more information, visit www.semtech.com/optical. 

 

Semtech® and the Semtech logo are registered trademarks or service marks of Semtech Corporation or its affiliates. Other product or service names mentioned herein may be the trademarks of their respective owners. 

 

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